Electronics & PCB
Underfill, thermal interface, sealing and potting.
APPLICATIONS
Applications for Indian manufacturing
We start with the real part, adhesive and takt time, then build the system around the process.
We start with the real part, adhesive and takt time, then build the system around the process.
Underfill, thermal interface, sealing and potting.
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ECU, BMS, sensors, chargers and power electronics.
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Module sealing, driver potting and lens bonding.
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Motors, coils, power supplies and appliances.
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Bonding, staking, sealing and continuous bead application.
Electrical insulation, moisture and vibration protection.
Grease, gel and gap-filling materials.
Epoxy, silicone and PU metering and mixing.
Offset compensation and mark alignment.
Conveyor, PLC and upstream/downstream integration.
Underfill, thermal interface, sealing and potting.
ECU, BMS, sensors, chargers and power electronics.
Module sealing, driver potting and lens bonding.
Motors, coils, power supplies and appliances.
Share the part, adhesive and target cycle time to start a practical configuration.